MRS Proceedings 2002 ,716(1): doi: http://​dx ​doi ​org/​10 ​1557

MRS Proceedings 2002.,716(1): doi: http://​dx.​doi.​org/​10.​1557/​PROC-716-B3.​2 45. Dimoulas A, Vellianitis G, Mavrou G, Apostolopoulos G, Travlos A, Wiemer C, Fanciulli M, Rittersma ZM: La 2 Hf 2 O 7 high- k gate dielectric grown directly on Si (001) by molecular-beam epitaxy. Appl Phys Lett 2004,15(85):3205–3207.CrossRef 46. Gang H, Deng B, Sun ZQ, Chen XS, Liu YM, Zhang VRT752271 LD: CVD-derived Hf-based high- k gate dielectrics. Crit

Rev Solid State Mater Sci 2013,4(38):235–261. 47. Watanabe H, Saitoh M, Ikarashi N, Tatsumi T: High-quality HfSixOy gate dielectrics fabricated by solid phase interface reaction between physical –vapor -deposited metal-Hf and SiO 2 underlayer. Appl Phys Lett 2004,3(85):449–451.CrossRef 48. Darbandy G, Ritzenthaler R, Lime F, Garduño I, Estrada M, Cerdeira A, Iñiguez B: Analytical modeling of direct tunneling current through gate stacks for the determination of suitable high- k dielectrics for nanoscale double-gate MOSFETs. Semicond Sci Technol 2011,4(26):045002.CrossRef 49. Myllymäki P, Roeckerath M, Putkonen M, Lenk S, Schubert

J, CYT387 clinical trial Niinistö L, Mantl S: Characterization and electrical properties of high- k GdScO 3 thin films grown by atomic layer deposition. Applied Physics A 2007,4(88):633–637.CrossRef 50. Chan KC, Lee PF, Li DF, Dai JY: Memory characteristics and the tunneling mechanism of Au nanocrystals embedded in a DyScO 3 high- k gate dielectric layer. Semicond Sci ifenprodil Technol 2011,2(26):025015.CrossRef 51. Milanov AP, Xu K, Cwik S, Parala H, de los Arcos T, Becker HW, Devi A: Sc 2 O 3 , Er 2 O 3 , and Y 2 O 3 thin films by MOCVD from volatile guanidinate class of rare-earth precursors. Dalton Trans 2012,45(41):13936–13947.CrossRef 52. Zhao CZ, Taylor S, Werner M, Chalker PR, Murray RT, Gaskell JM, Jones AC: Dielectric relaxation of lanthanum doped

zirconium oxide. J Appl Phys 2009, 105:044102.CrossRef 53. Zhao CZ, Taylor S, Werner M, Chalker PR, Gaskell JM, Jones AC: Frequency dispersion and dielectric relaxation of La 2 Hf 2 O 7 . J Vac Sci Technol B 2009,1(27):333.CrossRef 54. Zhao CZ, Werner M, Taylor S, Chalker PR, Jones AC, Zhao C: Dielectric relaxation of La-doped Zirconia caused by annealing ambient. Nanoscale Res Lett 2011, 6:48. 55. Zhao C, Zhao CZ, Tao J, Werner M, Taylor S, Chalker PR: Dielectric relaxation of lanthanide-based ternary oxides: physical and selleck mathematical models. J Nanomater 2012, 241470. 56. Tao J, Zhao CZ, Zhao C, Taechakumput P, Werner M, Taylor S, Chalker PR: Extrinsic and intrinsic frequency dispersion of high- k materials in capacitance-voltage measurements. Materials 2012, 5:1005–1032.CrossRef 57. Zhao C, Zhao CZ, Werner M, Taylor S, Chalker PR, King P: Grain size dependence of dielectric relaxation in cerium oxide as high- k layer. Nanoscale Res Lett 2013, 8:172.CrossRef 58. Schuegraf KF, King CC, Hu C: Impact of polysilicon depeletion in thin oxide MOS device. In VLSI Technology, Seattle, WA; 2–4 June 1992.

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