J Phys 2009, 72:587–599. 63. Majumdar K, Murali Kota VRM, Bhat N, Lin Y-M: Intrinsic limits of subthreshold slop in biased bilayer graphene transistor. Appl Phys Lett 2010, 96:123504.CrossRef 64. Sviličić B, Jovanović V, Suligoj T: Vertical silicon-on-nothing FET: subthreshold slope calculation using compact capacitance Pembrolizumab model. Inform MIDEM J Microelectron Electron Components Mater 2008, 38:1–4. Competing interests The authors declare

that they have no competing interests. Authors’ contributions MR wrote the manuscript, contributed to the design of the study, performed all the data analysis, and participated in the MATLAB simulation of the proposed device. Prof. RI and Dr. MTA participated in the conception of the project, improved the manuscript, and coordinated between all the participants. HK, MS, and EA organized the final version of the cover letter. All authors read and approved the final manuscript.”
“Background Increasing concerns regarding the escalating demand of energy consumption throughout the world has triggered the needs of developing energy-efficient high-power and high-temperature metal-oxide-semiconductor (MOS)-based devices. It has been

projected that gallium nitride (GaN) has the potential of conforming to the needs of these MOS-based devices due to its promising properties, which include wide bandgap (3.4 eV), large critical electric field (3 MV/cm), high electron mobility, as well as good thermal conductivity and stability

[1–6]. The fabrication of a functional Org 27569 GaN-based MOS device I-BET-762 price requires a high-quality gate oxide that is capable of resisting a high transverse electric field [7, 8]. Native oxide (Ga2O3) of GaN [9–13] and a relatively low-dielectric-constant (k) SiN x O y [2] or SiO2[14–19] have been successfully grown and deposited, respectively, as gate oxides in GaN-based MOS devices. However, these gate oxides are not the preferred choices. The shortcoming encountered by the former gate is the slow growth gate, high oxidation temperature (>700°C), and high leakage current [12, 13] while the latter gate with a relatively low k is unable to withstand the high electric field imposed on GaN [7, 20, 21]. Thereafter, numerous high-k gate oxides [3, 20–28] have been selected for investigation on GaN-based MOS devices. Recent exploration on the employment of radio frequency (RF) magnetron-sputtered Y2O3 gate subjected to post-deposition annealing (PDA) from 200°C to 1,000°C for 30 min in argon ambient has revealed that the Y2O3 gate annealed at 400°C has yielded the best current density-breakdown field (J-E) characteristic as well as the lowest effective oxide charge, interface trap density, and total interface trap density [25]. It is noticed that the acquired J-E characteristic for this sample is better than majority of the investigated gate oxide materials [25].